SDD Materials : Thin Front-end ASICs + conductive glue


Component Fraction by weight(1) A Z Density
[g/cm3]
Radiation Length
[cm]
Radiation Length
[g/cm2]
Si 0.731070 28.0855 14. 2.329 9.3648 21.82
Epotek E4110 0.268930 72.5841 31.9235 2.57022 4.90499 12.6069
SDD SI CHIP   40.0525 18.8292 2.38931 7.63235 182360
(1) The weight fractions depend on the effective thickness of the ASICs and of the glue. In this calculation the ASICs (PASCAL and AMBRA) are 150 μm thick and the condictive glue layer is 50 μm thick.

Calculation performed using the method described here .

The corresponding definition of this material in

 /* $Id: AliITSvPPRasymm.cxx,v 1.70 2003/08/14 20:24:51 nilsen Exp $ */ 
is:
  AliMaterial(7,"SDD SI CHIP$",0.374952E+02,0.178184E+02,0.24485E+01,0.76931E+01,0.99900E+03); 

 
 
 
  Back to SDD material page
Click here for comments and suggestions.