SDD Materials : Thick Front-end ASICs + conductive glue


Component Fraction by weight(1) A Z Density
[g/cm3]
Radiation Length
[cm]
Radiation Length
[g/cm2]
Si 0.844645 28.0855 14. 2.329 9.3648 21.82
Epotek E4110 0.155355 72.5841 31.9235 2.57022 4.90499 12.6069
SDD SI CHIP   34.9986 16.7845 2.36436 8.29094 19.5953
(1) The weight fractions depend on the effective thickness of the ASICs and of the glue. In this calculation the ASICs (PASCAL and AMBRA) are 300 μm thick and the condictive glue layer is 50 μm thick. In the real system the ASICs will have a thickness of 150 μm.

Calculation performed using the method described here .

The corresponding definition of this material in

 /* $Id: AliITSvPPRasymm.cxx,v 1.70 2003/08/14 20:24:51 nilsen Exp $ */ 
is:
  AliMaterial(7,"SDD SI CHIP$",0.374952E+02,0.178184E+02,0.24485E+01,0.76931E+01,0.99900E+03); 

 
 
 
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